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Ag2Se as a tougher alternative to n-type Bi2Te3 thermoelectrics.

Authors :
Liu, Min
Zhang, Xinyue
Zhang, Shuxian
Pei, Yanzhong
Source :
Nature Communications; 8/4/2024, Vol. 15 Issue 1, p1-6, 6p
Publication Year :
2024

Abstract

For half a century, only Bi<subscript>2</subscript>Te<subscript>3</subscript>-based thermoelectrics have been commercialized for near room temperature applications including both power generation and refrigeration. Because of the strong layered structure, Bi<subscript>2</subscript>Te<subscript>3</subscript> in particular for n-type conduction has to be texturized to utilize its high in-plane thermoelectric performance, leaving a substantial challenge in toughness. This work presents the fabrication and performance evaluation of thermoelectric modules based on n-type Ag<subscript>2</subscript>Se paring with commercial p-Bi<subscript>2</subscript>Te<subscript>3</subscript>. Ag<subscript>2</subscript>Se mechanically allows an order of magnitude larger fracture strain and thermoelectrically secures the module efficiency quite competitive to that of commercial one for both refrigeration and power generation within ± 50 K of room temperature, enabling a demonstration of a significantly tougher alternative to n-type Bi<subscript>2</subscript>Te<subscript>3</subscript> for practical applications. The authors report better toughness in n-type Ag<subscript>2</subscript>Se than commercial Bi<subscript>2</subscript>Te<subscript>3</subscript>. The fabricated n-Ag<subscript>2</subscript>Se/p-Bi<subscript>2</subscript>Te<subscript>3</subscript> modules show good performance and long-term stability for both refrigeration and power generation near room temperature. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
20411723
Volume :
15
Issue :
1
Database :
Complementary Index
Journal :
Nature Communications
Publication Type :
Academic Journal
Accession number :
178837184
Full Text :
https://doi.org/10.1038/s41467-024-50898-6