Thermo‐mechanical properties of epoxy composites filled with inorganic particulate fillers for robust solder mask application.

MLA

Lim, William Yung Ling, et al. “Thermo‐mechanical Properties of Epoxy Composites Filled with Inorganic Particulate Fillers for Robust Solder Mask Application.” Polymer International, vol. 73, no. 9, Sept. 2024, pp. 779–88. EBSCOhost, https://doi.org/10.1002/pi.6648.

APA

Lim, W. Y. L., Jaafar, M., Ishak, K. M. K., Chinniah, K., & Chan, W. K. (2024). Thermo‐mechanical properties of epoxy composites filled with inorganic particulate fillers for robust solder mask application. Polymer International, 73(9), 779–788. https://doi.org/10.1002/pi.6648

Chicago

Lim, William Yung Ling, Mariatti Jaafar, Ku Marsilla Ku Ishak, Karuna Chinniah, and Wooi Keong Chan. 2024. “Thermo‐mechanical Properties of Epoxy Composites Filled with Inorganic Particulate Fillers for Robust Solder Mask Application.” Polymer International 73 (9): 779–88. doi:10.1002/pi.6648.