The Comprehensive Effect of Electronic Irradiation and Thermal Cycling on the Thermal and Mechanical Properties of Sn-3.0Ag-0.5Cu Solder Joints.

The rapid development of aerospace electronics towards lightweight and miniaturized designs has put forward higher requirements for the reliability of device interconnection. It is crucial to study the effects of space radiation and thermal cycle environments on the performance of micro-solder joints. This study uses experimental and simulation methods to study the comprehensive effects of electron irradiation and thermal cycling on the mechanical and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) micro-solder joints. The results show that the combined effect of electron irradiation at a dose of 100 Mrad(Si) and 200 thermal cycles causes the operating temperature of the resistor in the sample to increase while severely reducing the shear strength of the solder joint. Two fracture modes, brittle and plastic, are observed in solder joints during the shearing process. As the number of thermal cycles increases, the proportion of plastic fracture increases. The combined effects of electron irradiation and thermal cycling exacerbate the deterioration of the shear strength of solder joints, with the shear strength of solder joints with brittle fractures decreasing by 28.00% and those with plastic fractures decreasing by 23.34%. [ABSTRACT FROM AUTHOR]