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Advancements in Remote Compressive Hyperspectral Imaging: Adaptive Sampling with Low-Rank Tensor Image Reconstruction.

Authors :
López, Oscar
Ernce, Alexa
Ouyang, Bing
Malkiel, Ed
Gong, Cuiling
Twardowski, Mike
Source :
Electronics (2079-9292); Jul2024, Vol. 13 Issue 14, p2698, 25p
Publication Year :
2024

Abstract

We advanced the practical development of compressive hyperspectral cameras for remote sensing scenarios with a design that simultaneously compresses and captures high-quality spectral information of a scene via configurable measurements. We built a prototype imaging system that is compatible with light-modulation devices that encode the incoming spectrum. The sensing approach enables a substantial reduction in the volume of data collected and transmitted, facilitating large-scale remote hyperspectral imaging. A main advantage of our sensing design is that it allows for adaptive sampling. When prior information of a survey region is available or gained, the modulation patterns can be re-programmed to efficiently sample and detect desired endmembers. Given target spectral signatures, we propose an optimization scheme that guides the encoding process. The approach severely reduces the number of required sampling patterns, with the ability to achieve image segmentation and correct distortions. Additionally, to decode the modulated data, we considered a novel reconstruction algorithm suited for large-scale images. The computational methodology leverages the multidimensional structure and redundant representation of hyperspectral images via the canonical polyadic decomposition of multiway arrays. Under realistic remote sensing scenarios, we demonstrated the efficiency of our approach with several data sets collected by our prototype camera and reconstructed by our low-rank tensor decoder. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
20799292
Volume :
13
Issue :
14
Database :
Complementary Index
Journal :
Electronics (2079-9292)
Publication Type :
Academic Journal
Accession number :
178691619
Full Text :
https://doi.org/10.3390/electronics13142698