Amkor Wins $600 Million in US Grants, Loans for Chip Packaging.

Amkor Technology Inc. has been awarded $400 million in US government grants and $200 million in loans for a chip packaging project in Arizona. The funding will support Amkor's $2 billion facility in Peoria, which is expected to create 2,000 jobs and package chips manufactured for Apple at Taiwan Semiconductor Manufacturing Co.'s new Phoenix complex. The US government aims to boost semiconductor manufacturing and reduce reliance on Asian supply lines through the Chips Act, which allocated $39 billion in grants, $75 billion in loans and guarantees, and 25% tax credits. The US currently has only 2% of the world's chip packaging capacity, compared to China's 38%. [Extracted from the article]