Production Test Challenges & Simplification for Multi-Chiplet Package Designs.

This article discusses the challenges and simplifications in production testing for multi-chiplet package designs. Multi-die systems, which consist of different functional blocks integrated within a single package, are becoming increasingly popular. The article highlights the importance of testability in package design and describes the complexities involved in testing multi-die packages. It also mentions the use of standards such as IEEE 1838 and Universal Chiplet Inter-Connect Express (UCIe) to address these challenges. The article concludes by emphasizing the need for collaboration and standardization in the test industry to accelerate technology maturity. [Extracted from the article]