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大尺寸 AlN 活性金属焊接覆铜基板的界面结合机理.

Authors :
许海仙
曾祥勇
朱家旭
周泽安
张振文
汤文明
Source :
Electronic Components & Materials; mai2024, Vol. 43 Issue 5, p573-584, 126p
Publication Year :
2024

Abstract

<i>Copyright of Electronic Components & Materials is the property of Electronic Components & Materials and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)

Details

Language :
Chinese
ISSN :
10012028
Volume :
43
Issue :
5
Database :
Complementary Index
Journal :
Electronic Components & Materials
Publication Type :
Academic Journal
Accession number :
178198213
Full Text :
https://doi.org/10.14106/j.cnki.1001-2028.2024.1545