Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition.

This document is an editorial for a special issue of the journal Micromachines focused on advanced interconnect and packaging technologies in the field of electronics. The editorial highlights the importance of these technologies in achieving high performance, miniaturization, and low power consumption in electronic devices. It introduces several research contributions included in the special issue, covering topics such as built-in packaging methods, bonding strength improvement, accurate characterization of interconnects, signal and power integrity analyses, crosstalk reduction, and reliability issues. The editorial acknowledges the challenges that remain in this field and expresses gratitude to the authors, editors, and reviewers involved in the special issue. [Extracted from the article]