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Electric current stressing enhanced damping properties in Sn5Sb solder.

Authors :
Liu, Linqiang
Chen, Feng
Li, Wangyun
Source :
Soldering & Surface Mount Technology; 2024, Vol. 36 Issue 3, p185-191, 7p
Publication Year :
2024

Abstract

Purpose: The purpose of this paper is to investigate the effects of electric current stressing on damping properties of Sn5Sb solder. Design/methodology/approach: Uniformly shaped Sn5Sb solders were prepared as samples. The length, width and thickness of the samples were 60.0, 5.0 and 0.5 mm, respectively. The damping properties of the samples were tested by dynamic mechanical analyzer with a cooling system to control the test temperature in the range of −100 to 100°C. Simultaneously, electric current was imposed to the tested samples using a direct current supply. After tests, the samples were characterized using scanning electron microscope, electron backscatter diffraction and transmission electron microscope, which was aimed to figure out the damping mechanism in terms of electric current stressing induced microstructure evolution. Findings: It is confirmed experimentally that the increase in damping properties is due to Joule heating and athermal effects of current stressing, in which Joule heating should make a higher contribution. G–L theory can be used to explain the damping properties of strain amplitude under current stressing by quantitative description of geometrically necessary dislocation density. While the critical strain amplitude and high temperature activation energy decrease with increasing electric current. Originality/value: These results provide a new method for vibration reliability evaluation of high-temperature lead-free solders in serving electronics. Notably, this method should be also inspiring for the mechanical performance evaluation and reliability assessment of conductive materials and structures serving under electric current stressing. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
09540911
Volume :
36
Issue :
3
Database :
Complementary Index
Journal :
Soldering & Surface Mount Technology
Publication Type :
Academic Journal
Accession number :
177246273
Full Text :
https://doi.org/10.1108/SSMT-02-2024-0005