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Evaluation of the microstructure, distribution of the intermetallic compounds, and mechanical behavior of SC07 solders with In, Ni, and TiO2 NPs minor additions.
- Source :
- Journal of Materials Science: Materials in Electronics; May2024, Vol. 35 Issue 13, p1-30, 30p
- Publication Year :
- 2024
-
Abstract
- In this paper, the impact of small additions of indium (In), nickel (Ni), and Titanium dioxide nanoparticles (TiO<subscript>2</subscript> NPs) in the microstructure and characterization of eutectic Sn–0.7 Cu (SC07)-based solder were investigated. The third element In, Ni, or TiO<subscript>2</subscript> NPs were added in varying amounts 0.4 or 0.8 wt% to SC07 alloy by replacing an equal amount of Sn for each addition. Structural analysis of the investigated samples showed that the addition of Ni or In modified the eutectic composition, leading to the appearance of primary phases (Cu<subscript>6</subscript>Sn<subscript>5</subscript>) followed by the formation of intermetallic compounds (IMCs) (Cu, Ni)<subscript>6</subscript>Sn<subscript>5</subscript> and Cu<subscript>6</subscript>(Sn, In)<subscript>5</subscript>. However, addition of TiO<subscript>2</subscript> NPs did not lead to formation of any new IMCs but refine β-Sn dendrites grains with a decrease in the volume fraction of Cu<subscript>6</subscript>Sn<subscript>5</subscript> IMC. The crystallite size, lattice strain, and dislocation density of the SC07 solder alloy were improved in terms of third addition. The results indicated that the smallest crystallite size for SC07–0.8In associated with largest lattice strain and highest dislocation density. Microhardness tests were performed for all samples at room temperature. The results illustrate the enhancement indentation creep resistance of SC07 reinforced solder, which inherently correlates to the microstructure refinement and the formation of intermetallic phases (Cu, Ni)<subscript>6</subscript>Sn<subscript>5</subscript> and Cu<subscript>6</subscript>(Sn, In)<subscript>5</subscript> with higher hardness values. The obtained stress exponent values are in the range 9.26–11.46 for all tested alloys which close to that creep mechanisms associated with dislocation movement such as dislocation creep are predominant. Thus, we conclude that the greatest value of stress exponent for SC07–0.8In (10.9–11.46) at different loads suggested to be more resistant to indentation creep which improves the mechanical strength compared to other solders. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 09574522
- Volume :
- 35
- Issue :
- 13
- Database :
- Complementary Index
- Journal :
- Journal of Materials Science: Materials in Electronics
- Publication Type :
- Academic Journal
- Accession number :
- 177121218
- Full Text :
- https://doi.org/10.1007/s10854-024-12688-0