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SOP8 功率 MOSFET 结壳热阻与封装可靠性研究.
- Source :
- Electronic Components & Materials; mar2024, Vol. 43 Issue 3, p359-366, 8p
- Publication Year :
- 2024
-
Abstract
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Details
- Language :
- Chinese
- ISSN :
- 10012028
- Volume :
- 43
- Issue :
- 3
- Database :
- Complementary Index
- Journal :
- Electronic Components & Materials
- Publication Type :
- Academic Journal
- Accession number :
- 176958417
- Full Text :
- https://doi.org/10.14106/j.cnki.1001-2028.2024.1375