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SOP8 功率 MOSFET 结壳热阻与封装可靠性研究.

Authors :
何成刚
朱岚涤
陈胜全
农百乐
刘吉华
Source :
Electronic Components & Materials; mar2024, Vol. 43 Issue 3, p359-366, 8p
Publication Year :
2024

Abstract

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Details

Language :
Chinese
ISSN :
10012028
Volume :
43
Issue :
3
Database :
Complementary Index
Journal :
Electronic Components & Materials
Publication Type :
Academic Journal
Accession number :
176958417
Full Text :
https://doi.org/10.14106/j.cnki.1001-2028.2024.1375