Cite
High gain D‐band hybrid integrated on‐chip antenna based on low‐cost printed circuit board packaging technology.
MLA
Wang, Yanjun, et al. “High Gain D‐band Hybrid Integrated On‐chip Antenna Based on Low‐cost Printed Circuit Board Packaging Technology.” Microwave & Optical Technology Letters, vol. 66, no. 4, Apr. 2024, pp. 1–7. EBSCOhost, https://doi.org/10.1002/mop.34146.
APA
Wang, Y., Yi, X., Che, W., & Xue, Q. (2024). High gain D‐band hybrid integrated on‐chip antenna based on low‐cost printed circuit board packaging technology. Microwave & Optical Technology Letters, 66(4), 1–7. https://doi.org/10.1002/mop.34146
Chicago
Wang, Yanjun, Xiang Yi, Wenquan Che, and Quan Xue. 2024. “High Gain D‐band Hybrid Integrated On‐chip Antenna Based on Low‐cost Printed Circuit Board Packaging Technology.” Microwave & Optical Technology Letters 66 (4): 1–7. doi:10.1002/mop.34146.