SiO2f/SiO2 composite grinding characteristics based on maximum undistorted chip thickness.

The thickness of the maximum undistorted chip (a_gmax) is a crucial component of the machining arguments and significantly affects the quality of the grind. For the purpose of investigating the impact of the a_gmax on the grinding removal properties of SiO_2f/SiO₂ composites, grinding experiments of SiO_2f/SiO₂ composites were conducted. The findings indicate that crack propagation, fiber cracking, matrix breaking, and interface debonding are the primary removal modes of SiO_2f/SiO₂ composites. Grinding force, surface roughness, and chip size all have a positive correlation with the maximum undeformed chip thickness. Surface brittle fracture brought on by SiO₂ fiber microcrack results in little surface roughness. The surface quality degrades when bending fracture and compression fracture take place. Controlling the a_gmax can enhance the grinding surface quality of SiO_2f/SiO₂ composites. [ABSTRACT FROM AUTHOR]