Enhancing Electrical and Physical Contacts of Copper‐Electroplated Silicon Heterojunction Solar Cells through Chemical Pretreated Seed Layers.

MLA

Wang, Taiqiang, et al. “Enhancing Electrical and Physical Contacts of Copper‐Electroplated Silicon Heterojunction Solar Cells through Chemical Pretreated Seed Layers.” Solar RRL, vol. 8, no. 5, Mar. 2024, pp. 1–9. EBSCOhost, https://doi.org/10.1002/solr.202300938.

APA

Wang, T., Du, H., Xing, M., Cao, F., Liao, M., Liu, W., Wang, W., Han, C., Yang, Z., Zeng, Y., & Ye, J. (2024). Enhancing Electrical and Physical Contacts of Copper‐Electroplated Silicon Heterojunction Solar Cells through Chemical Pretreated Seed Layers. Solar RRL, 8(5), 1–9. https://doi.org/10.1002/solr.202300938

Chicago

Wang, Taiqiang, Haojiang Du, Mengchao Xing, Fangfang Cao, Mingdun Liao, Wei Liu, Weiyan Wang, et al. 2024. “Enhancing Electrical and Physical Contacts of Copper‐Electroplated Silicon Heterojunction Solar Cells through Chemical Pretreated Seed Layers.” Solar RRL 8 (5): 1–9. doi:10.1002/solr.202300938.