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Achieving environmental stability in an atomically thin quantum spin Hall insulator via graphene intercalation.

Authors :
Schmitt, Cedric
Erhardt, Jonas
Eck, Philipp
Schmitt, Matthias
Lee, Kyungchan
Keßler, Philipp
Wagner, Tim
Spring, Merit
Liu, Bing
Enzner, Stefan
Kamp, Martin
Jovic, Vedran
Jozwiak, Chris
Bostwick, Aaron
Rotenberg, Eli
Kim, Timur
Cacho, Cephise
Lee, Tien-Lin
Sangiovanni, Giorgio
Moser, Simon
Source :
Nature Communications; 2/19/2024, Vol. 15 Issue 1, p1-7, 7p
Publication Year :
2024

Abstract

Atomic monolayers on semiconductor surfaces represent an emerging class of functional quantum materials in the two-dimensional limit — ranging from superconductors and Mott insulators to ferroelectrics and quantum spin Hall insulators. Indenene, a triangular monolayer of indium with a gap of ~ 120 meV is a quantum spin Hall insulator whose micron-scale epitaxial growth on SiC(0001) makes it technologically relevant. However, its suitability for room-temperature spintronics is challenged by the instability of its topological character in air. It is imperative to develop a strategy to protect the topological nature of indenene during ex situ processing and device fabrication. Here we show that intercalation of indenene into epitaxial graphene provides effective protection from the oxidising environment, while preserving an intact topological character. Our approach opens a rich realm of ex situ experimental opportunities, priming monolayer quantum spin Hall insulators for realistic device fabrication and access to topologically protected edge channels. Topological states in atomically thin quantum spin Hall insulators suffer from instability against environmental factors. Here, the authors devise a strategy to preserve topologically protected states in monolayer indenene through graphene intercalation. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
20411723
Volume :
15
Issue :
1
Database :
Complementary Index
Journal :
Nature Communications
Publication Type :
Academic Journal
Accession number :
175798725
Full Text :
https://doi.org/10.1038/s41467-024-45816-9