Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.

MLA

Lee, Jing Rou, et al. “Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.” Journal of Electronic Materials, vol. 53, no. 3, Mar. 2024, pp. 1201–13. EBSCOhost, https://doi.org/10.1007/s11664-023-10855-3.

APA

Lee, J. R., Abdul Aziz, M. S., Khor, C. Y., Ishak, M. H. H., Kamarudin, R., & Ani, F. C. (2024). Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction. Journal of Electronic Materials, 53(3), 1201–1213. https://doi.org/10.1007/s11664-023-10855-3

Chicago

Lee, Jing Rou, Mohd Sharizal Abdul Aziz, Chu Yee Khor, Mohammad Hafifi Hafiz Ishak, Roslan Kamarudin, and F. Che Ani. 2024. “Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.” Journal of Electronic Materials 53 (3): 1201–13. doi:10.1007/s11664-023-10855-3.