Enhanced Thermoelectric Performance of a HfS2 Bilayer by Strain Engineering.

MLA

Wang, Hao, et al. “Enhanced Thermoelectric Performance of a HfS2 Bilayer by Strain Engineering.” Journal of Electronic Materials, vol. 52, no. 10, Oct. 2023, pp. 6537–50. EBSCOhost, https://doi.org/10.1007/s11664-023-10443-5.

APA

Wang, H., Xiang, J., Dai, B., Ge, N.-N., Zhang, X.-W., & Ji, G.-F. (2023). Enhanced Thermoelectric Performance of a HfS2 Bilayer by Strain Engineering. Journal of Electronic Materials, 52(10), 6537–6550. https://doi.org/10.1007/s11664-023-10443-5

Chicago

Wang, Hao, Juan Xiang, Bo Dai, Ni-Na Ge, Xiao-Wei Zhang, and Guang-Fu Ji. 2023. “Enhanced Thermoelectric Performance of a HfS2 Bilayer by Strain Engineering.” Journal of Electronic Materials 52 (10): 6537–50. doi:10.1007/s11664-023-10443-5.