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Minimizing the Uncertainties Associated With the Measurement of Thermal Properties by the Transient Thermo-Reflectance Method.

Authors :
Burzo, Mihai G.
Komarov, Pavel L.
Raad, Peter E.
Source :
IEEE Transactions on Components & Packaging Technologies; Mar2005, Vol. 28 Issue 1, p39-44, 6p
Publication Year :
2005

Abstract

The article presents an approach for optimizing the transient thermo-reflectance measurement of thermal properties. As electronic devices become smaller, their thermal design becomes more critical, making the knowledge of thermal properties essential to the overall design process. Additionally, new device structures and materials with superior properties are being developed, but many of these may have unknown thermo-physical properties. Moreover, recent studies have revealed that the thermal properties of thin-film materials used in electronics are dependent on the deposition process.

Details

Language :
English
ISSN :
15213331
Volume :
28
Issue :
1
Database :
Complementary Index
Journal :
IEEE Transactions on Components & Packaging Technologies
Publication Type :
Academic Journal
Accession number :
16608198
Full Text :
https://doi.org/10.1109/TCAPT.2004.843189