Wednesday, October 5, 2022.

Subjects

Subjects :

FLIP chip technology
WIRE bonding (Electronic packaging)
MILLIMETER wave antennas
THERMAL interface materials
PACKAGING materials
HIGH cycle fatigue

Details

Language :

English

ISSN :

23807008

Volume :

49

Issue :

4

Database :

Complementary Index

Journal :

Advancing Microelectronics

Publication Type :

Periodical

Accession number :

164103664