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Understanding Electroless Nickel Thickness in ENIG and ENEPIG: The actual phosphorus content in the deposit must be considered.

Authors :
WEBER, ROBERT
Source :
Printed Circuit Design & Fab: Circuits Assembly; Apr2023, Vol. 40 Issue 4, p76-85, 10p
Publication Year :
2023

Subjects

Subjects :
NICKEL
PRINTED circuits industry
COPPER surfaces

Details

Language :
English
ISSN :
19395442
Volume :
40
Issue :
4
Database :
Complementary Index
Journal :
Printed Circuit Design & Fab: Circuits Assembly
Publication Type :
Periodical
Accession number :
162904514

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Authors Abstract Subjects Details