In situ electron-beam-induced mechanical loading and fracture of suspended strained silicon nanowires.

The mechanical properties characterization of silicon nanowires is generally performed by tensile nanomechanical loading tests with in situ strain quantification. While the strain is characterized by electron beam (e-beam) microscopy techniques, the understanding of the sample-electron interaction is essential to guarantee artifact-free measurements. In this work, we investigated suspended strained silicon nanowires under electron beam exposure in a scanning electron microscope (SEM). The fabricated nanowires had their initial stress profile characterized by Raman spectroscopy and finite element method simulations. Then, the sample was exposed to an e-beam where we observed a gradual electrical charging of the sample, verified by the image drift, and down deflection of the suspended nanowire caused by electrostatic forces. These additional stresses induced the mechanical fracture of the nanowires in the corner region due to accumulated stress. These results ascribe electrostatic mechanical loading concerns that may generate undesirable additional stresses in nanomechanical tests performed in SEM, demonstrating the importance of proper sample preparation to avoid electrostatic charging effects. Here, we propose a simple and effective method for imposing the structures under an impinging electron beam at an equipotential, which mitigates the charging effects acting on the nanowire. [ABSTRACT FROM AUTHOR]