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超导量子芯片集成技术概述.

Authors :
郑伟文
李晓伟
熊康林
冯加贵
Source :
Electronic Components & Materials; Nov2022, Issue 11, p1143-1148, 6p
Publication Year :
2022

Abstract

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Details

Language :
Chinese
ISSN :
10012028
Issue :
11
Database :
Complementary Index
Journal :
Electronic Components & Materials
Publication Type :
Academic Journal
Accession number :
161332840
Full Text :
https://doi.org/10.14106/j.cnki.1001-2028.2022.0249