Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects.

MLA

Wang, Yao, et al. “Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects.” Micromachines, vol. 13, no. 12, Dec. 2022, p. 2081. EBSCOhost, https://doi.org/10.3390/mi13122081.

APA

Wang, Y., Hu, C., Xiang, X., Zheng, W., Yin, Z., & Cui, Y. (2022). Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects. Micromachines, 13(12), 2081. https://doi.org/10.3390/mi13122081

Chicago

Wang, Yao, Chuan Hu, Xun Xiang, Wei Zheng, Zhendong Yin, and Yinhua Cui. 2022. “Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects.” Micromachines 13 (12): 2081. doi:10.3390/mi13122081.