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Improved Thermal Properties and Erosion Resistance of Silicone Composites With Hexagonal Boron Nitride.

Authors :
Khanum, Khadija Kanwal
Jayaram, Shesha H.
Source :
IEEE Transactions on Industry Applications; Sep/Oct2022, Vol. 58 Issue 5, p6583-6590, 8p
Publication Year :
2022

Abstract

In this article, silicone rubber (SiR) is filled with industry preferred micro-silica and specialty hexagonal boron nitride (h-BN) nanosheets, by varying the ratio between the two fillers, while keeping the filler to matrix ratio the same in all three composites. The fillers are added to SiR using an electrostatic disperser which aids in homogenizing the filler-polymer mixture by means of shearing force along with elongation. The performance of synthesized silicone composites are evaluated using thermal, erosion resistance, morphological, mechanical, and high-temperature dielectric properties. Addition of as low as 5 wt% h-BN fillers significantly improved the thermal properties; 6%–20% improvement in thermal conductivity and in less than half the weight loss compared to only silica filled composites with laser erosion. The morphological and mechanical analyses showed improved filler dispersion and filler to silicone matrix interaction owing to good filler dispersion achieved through the electrostatic dispersing method. The dielectric properties measured in wide frequency range, between 10−4 and 103 Hz and at elevated temperatures (up to 175 °C) showed a negligible effect of increase in h-BN content. Thus, this article implies that low amounts of h-BN in silica-silicone composites improve thermal conductivity and erosion resistance significantly and not altering the dielectric responses of these hybrid composites even at elevated temperatures. Hence these composites can find applications both in the high voltage industry and as electronic packaging materials. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00939994
Volume :
58
Issue :
5
Database :
Complementary Index
Journal :
IEEE Transactions on Industry Applications
Publication Type :
Academic Journal
Accession number :
160651580
Full Text :
https://doi.org/10.1109/TIA.2022.3186286