Hybrid interconnection schemes for output power enhancement of solar photovoltaic array under partial shading conditions.

Partial shading conditions (PSC) across the solar photovoltaic (PV) array reduce the overall power yield of the PV plant. Therefore, it is essential to decrease mismatch power loss (MPL) incurred under PSC. For this purpose, total‐cross‐tied (TCT)‐based 'hybrid interconnection' schemes of solar PV array are investigated in the present research work. Proposed novel hybrid bridge‐link (BL)‐TCT and honey‐comb (HC)‐TCT interconnection schemes are found to be effective alternatives to achieve increased solar PV array output power. The performance of the proposed 'hybrid interconnection' schemes is studied by subjecting the 9 × 9 sized solar PV array under four different categories of PSC. The efficacy of the proposed 'hybrid interconnection' schemes is justified to be superior by comparing the simulation results obtained from the proposed interconnection schemes with the earlier reported conventional 'S‐P, B‐L, H‐C, and traditional TCT' interconnection schemes. Further, it is observed that output power is additionally enhanced using a bypass diode connected across individual modules of the solar PV array. The simulation results indicate that the proposed 'hybrid interconnection' schemes with values of 17.5%, 21.28%, 54.33%, and 50.4% under four categories of typical PSC have the lowest MPL relatively compared to that of literature‐reported conventional interconnection schemes. In addition, the proposed 'hybrid interconnection' schemes with the performance enhancement (PE) values of 82.5%, 78.7%, 45.66%, and 49.6% under four categories of typical PSC have the highest PE relatively compared to literature‐reported conventional interconnection schemes. Based on the comparative analysis of results obtained upon four typical PSC, it is concluded that the proposed 'hybrid interconnection' schemes provide a relatively superior output performance compared to that of the conventional 'S‐P, B‐L, H‐C, and traditional TCT' interconnection schemes. [ABSTRACT FROM AUTHOR]