Micro-Mechanism Influence of Copper on Thermal Decomposition of Vegetable Oil-Paper Insulation Based on ReaxFF-MD.

MLA

Cong, Haoxi, et al. “Micro-Mechanism Influence of Copper on Thermal Decomposition of Vegetable Oil-Paper Insulation Based on ReaxFF-MD.” IEEE Transactions on Dielectrics & Electrical Insulation, vol. 29, no. 3, June 2022, pp. 906–14. EBSCOhost, https://doi.org/10.1109/TDEI.2022.3168339.

APA

Cong, H., Hu, X., Du, Y., Shao, H., & Li, Q. (2022). Micro-Mechanism Influence of Copper on Thermal Decomposition of Vegetable Oil-Paper Insulation Based on ReaxFF-MD. IEEE Transactions on Dielectrics & Electrical Insulation, 29(3), 906–914. https://doi.org/10.1109/TDEI.2022.3168339

Chicago

Cong, Haoxi, Xuefeng Hu, Yulin Du, Huiming Shao, and Qingmin Li. 2022. “Micro-Mechanism Influence of Copper on Thermal Decomposition of Vegetable Oil-Paper Insulation Based on ReaxFF-MD.” IEEE Transactions on Dielectrics & Electrical Insulation 29 (3): 906–14. doi:10.1109/TDEI.2022.3168339.