50‐3: Status of MicroLED Mass‐Transfer Processes and Equipment.

For MicroLED displays to be economically viable, microchip transfer and assembly technologies with micron‐scale accuracy, and throughputs at least 5 orders of magnitude higher than traditional pick‐and‐place and bonding equipment are required. This paper discusses existing and emerging technologies, from the lab to commercially available solution. [ABSTRACT FROM AUTHOR]