Electrode Engineering in Halide Perovskite Electronics: Plenty of Room at the Interfaces.

MLA

Lin, Chun‐Ho, et al. “Electrode Engineering in Halide Perovskite Electronics: Plenty of Room at the Interfaces.” Advanced Materials, vol. 34, no. 18, May 2022, pp. 1–29. EBSCOhost, https://doi.org/10.1002/adma.202108616.

APA

Lin, C., Hu, L., Guan, X., Kim, J., Huang, C., Huang, J., Singh, S., & Wu, T. (2022). Electrode Engineering in Halide Perovskite Electronics: Plenty of Room at the Interfaces. Advanced Materials, 34(18), 1–29. https://doi.org/10.1002/adma.202108616

Chicago

Lin, Chun‐Ho, Long Hu, Xinwei Guan, Jiyun Kim, Chien‐Yu Huang, Jing‐Kai Huang, Simrjit Singh, and Tom Wu. 2022. “Electrode Engineering in Halide Perovskite Electronics: Plenty of Room at the Interfaces.” Advanced Materials 34 (18): 1–29. doi:10.1002/adma.202108616.