Preparation and application of filler-free waterborne epoxy resin with high thixotropy.

The epoxy resin E51 was modified by PA and DEOA, and polar groups such as hydroxyl, tertiary amine and amide bond were introduced into the epoxy resin molecular structure through ring-opening addition reaction, presenting ideal hydrophilcity. The modified epoxy resin system does not need an external thixotropic agent. After mixing with water, the hydrogen bond interaction between the resin particles can endow the system with excellent thixotropy. The effects of the reaction temperature, type and molar ratio of reactants on the properties of the filler -free waterborne epoxy resin with high thixotropyare discussed and the optimal preparation conditions are obtained. The test results show that after mixing with the curing agent, the waterborne epoxy adhesive has excellent anti-sagging performance, good mechanical properties of the cured product, and high practicability. [ABSTRACT FROM AUTHOR]