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芯片封装用单组份高导热结构胶的 研制及性能表征.
- Source :
- Insulating Materials; Mar2022, Vol. 55 Issue 3, p38-44, 7p
- Publication Year :
- 2022
Details
- Language :
- Chinese
- ISSN :
- 10099239
- Volume :
- 55
- Issue :
- 3
- Database :
- Complementary Index
- Journal :
- Insulating Materials
- Publication Type :
- Academic Journal
- Accession number :
- 155898052
- Full Text :
- https://doi.org/10.16790/j.cnki.1009-9239.im.2022.03.005