Analysis of the uniformity of material removal in double-sided grinding based on thermal–mechanical coupling.

In double-sided grinding, the material removal on the surface of the workpiece is non-uniform. The thermal deformation of the material may be one of the influencing factors. However, it is difficult to predict and measure the temperature field distribution in the workpiece in double-sided grinding. In this paper, based on the grain trajectory model, a single effective abrasive grain is regarded as a moving point heat source, and the new model of temperature field and workpiece thermal deformation is established based on the thermal–mechanical coupling effect. The distribution characteristics of the temperature field in the workpiece and the axial deformation of the workpiece under different processing parameters are calculated. Finally, a double-sided grinding experiment is carried out to measure the surface profile of the workpiece under different processing parameters to verify the accuracy of the established model. This article solves the problem of the unpredictable temperature field of the workpiece in double-sided grinding and has guiding significance for improving the surface quality of the workpiece in double-sided grinding through the optimization of processing parameters. [ABSTRACT FROM AUTHOR]