Growth of flat-topped, mound-shaped grains with voids when depositing silver thin films at high substrate temperatures using direct-current magnetron sputtering.

Thin films of silver were deposited on nonalkali glass substrates at substrate temperatures ranging from room temperature (28 °C) to 150, 200, 300, 400, and 500 °C at discharge pressures of 0.40, 1.20, and 2.00 Pa using direct current magnetron sputtering. On the basis of the measured cross-sectional and surface morphologies, crystallographic structures, and film properties, I discuss the dependence of the film structure and properties on the substrate temperature. The x-ray diffraction measurements showed that the <111> orientation was preferred for all deposition conditions. Scanning electron microscope observations revealed a microstructure of convex-shaped fine grains for a substrate at room temperature, while laterally growing, mound-shaped grains with flat-topped surfaces appeared at substrate temperatures of 400 and 500 °C. Atomic force microscopy also showed an increase in the lateral size and height of the mound-shaped structures with increasing substrate temperature. The lateral grain size evaluated from the areal particle density obtained from atomic force microscopy increased significantly with increasing substrate temperature, reaching 600–800 nm at a substrate temperature of 500 °C. The film stress also changed from compressive to tensile with increasing substrate temperature. The relative density, defined as the ratio of the deposited amount-of-substance to the physical-thickness, decreased significantly with increasing substrate temperature and, at a substrate temperature of 500 °C, was approximately 0.6 times as large as that obtained for thin films deposited at room temperature. The high surface diffusivity of the Ag adatoms induces the growth of laterally growing, mound-shaped grains. Besides, the energy accumulated in the thin films during sputter deposition induces the void formation to increase the efficiency of energy release in the form of heat. [ABSTRACT FROM AUTHOR]