Cite
Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC.
MLA
Yan, Shuang, et al. “Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC.” Polymers (20734360), vol. 13, no. 18, Sept. 2021, p. 3085. EBSCOhost, https://doi.org/10.3390/polym13183085.
APA
Yan, S., Verestek, W., Zeizinger, H., & Schmauder, S. (2021). Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC. Polymers (20734360), 13(18), 3085. https://doi.org/10.3390/polym13183085
Chicago
Yan, Shuang, Wolfgang Verestek, Harald Zeizinger, and Siegfried Schmauder. 2021. “Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC.” Polymers (20734360) 13 (18): 3085. doi:10.3390/polym13183085.