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P‐117: Analysis of Boundary Image Sticking Mechanism and Model Establishment.
- Source :
- SID Symposium Digest of Technical Papers; May2021, Vol. 52 Issue 1, p1235-1237, 3p
- Publication Year :
- 2021
-
Abstract
- The article studied the 8K product in the black and white checkerboard test, because the 8K product Pixel design is reduced, the in‐plane circuit is increased, and there is a lateral electric field in the black and white area, which causes the ion to move and form a line afterimage. This article describes the adjustment The DBS voltage forms a vertical electric field in the middle of the pixel, which is similar to adding an example of a moving speed bump to prevent the lateral movement of ions, thereby improving the afterimage at the black and white junction. [ABSTRACT FROM AUTHOR]
- Subjects :
- IMAGE analysis
ELECTRIC fields
SPEED bumps
PRODUCT design
VOLTAGE
Subjects
Details
- Language :
- English
- ISSN :
- 0097966X
- Volume :
- 52
- Issue :
- 1
- Database :
- Complementary Index
- Journal :
- SID Symposium Digest of Technical Papers
- Publication Type :
- Academic Journal
- Accession number :
- 151134857
- Full Text :
- https://doi.org/10.1002/sdtp.14922