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Project ameliz: Patterning techniques for copper electroplated metallization on heterojunction solar cells.

Authors :
Lachowicz, Agata
Andreatta, Gaëlle
Blondiaux, Nicolas
Faes, Antonin
Badel, Nicolas
Leon, Juan J. Diaz
Allébe, Christophe
Fontaine, Charly
Haumesser, Paul-Henri
Jourdan, Johann
Muñoz, Delfina
Godard, Maxime
Darmon, Maxime
Nicolay, Sylvain
Despeisse, Matthieu
Ballif, Christophe
Tous, Loic
Beaucarne, Guy
Lossen, Jan
Schubert, Gunnar
Source :
AIP Conference Proceedings; 2020, Vol. 2367 Issue 1, p1-8, 8p
Publication Year :
2020

Abstract

For the current PV production about 2000 tons of silver are consumed per year, 10% of the entire world annual silver supply. The PV production is expected to grow significantly in the next decades in order to enable the energy transition to 100% renewables. Annual production volumes in the terawatt range are predicted already for 2030 and this may lead to higher silver price and put more pressure on the industry to replace silver by copper. Within the Ameliz project several patterning approaches for copper electrodeposition on heterojunction cells are developed: firstly, patterning by printing a metal seed grid with a dielectric layer as plating mask and secondly masking by a monolayer of self-assembling molecules. These molecules consist of a phosphonic acid group and a hydrocarbon chain. They are bonded to the ITO surface and form a monolayer of well-ordered, densely packed hydrophobic chains, which protects the ITO surface against plating solutions. Furthermore, methods for selective formation of a copper seed layer by electrografting and for improved adhesion by ITO reduction are being investigated. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
0094243X
Volume :
2367
Issue :
1
Database :
Complementary Index
Journal :
AIP Conference Proceedings
Publication Type :
Conference
Accession number :
150610508
Full Text :
https://doi.org/10.1063/5.0056227