Effect of Solder Particle Size on the Mechanical and Thermal Reliability of Au/Sn Ag Cu/Cu Solder Joints.

Details

Language :

English

ISSN :

21628769

Volume :

10

Issue :

4

Database :

Complementary Index

Journal :

ECS Journal of Solid State Science & Technology

Publication Type :

Academic Journal

Accession number :

150158584

Full Text :

https://doi.org/10.1149/2162-8777/abf517