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络合剂DTPA-5K 在集成电路阻挡层CMP中的 应用及机理分析.

Authors :
霍兆晴
牛新环
刘玉岭
杨程辉
卢亚楠
Source :
Electronic Components & Materials; Feb2021, Vol. 40 Issue 2, p156-162, 7p
Publication Year :
2021

Abstract

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Details

Language :
Chinese
ISSN :
10012028
Volume :
40
Issue :
2
Database :
Complementary Index
Journal :
Electronic Components & Materials
Publication Type :
Academic Journal
Accession number :
149256389
Full Text :
https://doi.org/10.14106/j.cnki.1001-2028.2021.1771