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Semi-Supervised Multi-Modal Clustering and Classification with Incomplete Modalities.
- Source :
- IEEE Transactions on Knowledge & Data Engineering; Feb2021, Vol. 33 Issue 2, p682-695, 14p
- Publication Year :
- 2021
-
Abstract
- In this paper, we propose a novel Semi-supervised Learning with Incomplete Modality (SLIM) method considering the modal consistency and complementarity simultaneously, and Kernel SLIM (SLIM-K) based on matrix completion for further solving the modal incompleteness. As is well known, most realistic data have multi-modal representations, multi-modal learning refers to the process of learning a precise model for complete modalities. However, due to the failures of data collection, self-deficiencies, or other various reasons, multi-modal examples are usually with incomplete modalities, which generate utility obstacle using previous methods. In this paper, SLIM integrates the intrinsic consistency and extrinsic complementary information for prediction and cluster simultaneously. In detail, SLIM forms different modal classifiers and clustering learner consistently in a unified framework, while using the extrinsic complementary information from unlabeled data against the insufficiencies brought by the incomplete modal issue. Moreover, in order to deal with missing modality in essence, we propose the SLIM-K, which takes the complemented kernel matrix into the classifiers and the cluster learner respectively. Thus, SLIM-K can solve the defects of missing modality in result. Finally, we give the discussion of generalization of incomplete modalities. Experiments on 13 benchmark multi-modal datasets and two real-world incomplete multi-modal datasets validate the effectiveness of our methods. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 10414347
- Volume :
- 33
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Knowledge & Data Engineering
- Publication Type :
- Academic Journal
- Accession number :
- 148208439
- Full Text :
- https://doi.org/10.1109/TKDE.2019.2932742