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A Novel Technique to Re-construct 3D Void in Passivated Metal Interconnects.

Authors :
Tan, Cher Ming
Gan, Zhenghao
Zhang, Guan
Prasad, Krishnamachar
Zhang, Dao Hua
Source :
MRS Online Proceedings Library; 2003, Vol. 766 Issue 1, p1-6, 6p
Publication Year :
2003

Details

Language :
English
ISSN :
19464274
Volume :
766
Issue :
1
Database :
Complementary Index
Journal :
MRS Online Proceedings Library
Publication Type :
Conference
Accession number :
147998825
Full Text :
https://doi.org/10.1557/PROC-766-E4.8