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Temperature Field Simulation and Verification in Curing Process of Epoxy Resin Insulator.

Authors :
CHEN Rui
YUAN Duanpeng
KAN Chaohao
HAO Liucheng
LI Caina
ZHANG Pei
WANG Yaxiang
Source :
Insulating Materials; 2020, Issue 11, p1-5, 5p
Publication Year :
2020

Details

Language :
Chinese
ISSN :
10099239
Issue :
11
Database :
Complementary Index
Journal :
Insulating Materials
Publication Type :
Academic Journal
Accession number :
147609359
Full Text :
https://doi.org/10.16790/j.cnki.1009-9239.im.2020.11.001