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Book Reviews.

Authors :
Shea, John J.
Rangarajan, S.
Balaji, C.
Werneck, M. M.
Allil, R.
Brener, I.
Liu, S.
Staude, I.
Valentine, J.
Holloway, C.
Peelo, D. F.
Arora, R.
Rajpurohit, B. S.
Bensky, A.
Lednor, P. W.
Source :
IEEE Electrical Insulation Magazine; Jan2021, Vol. 37 Issue 1, p43-46, 4p
Publication Year :
2021

Abstract

When a material undergoes a phase change such as a solid turning into a liquid, generally energy is absorbed by the material in order to change from a solid to a liquid. This energy absorption, at the phase change point, can be utilized to enhance a heat sink capacity during transient events to control the temperature rise in an electronic component. Phase-change materials (PCM) can be incorporated into a heatsink to provide the additional energy absorption and heat dissipation during these transient thermal events in electronic components to allow for great operating range. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
08837554
Volume :
37
Issue :
1
Database :
Complementary Index
Journal :
IEEE Electrical Insulation Magazine
Publication Type :
Review
Accession number :
147575063
Full Text :
https://doi.org/10.1109/MEI.2021.9290464