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Surgical Wounds Assessment System for Self-Care.

Authors :
Chen, Yung-Wei
Hsu, Jui-Tse
Hung, Chih-Chieh
Wu, Jin-Ming
Lai, Feipei
Kuo, Sy-Yen
Source :
IEEE Transactions on Systems, Man & Cybernetics. Systems; Dec2020, Vol. 50 Issue 12, p5076-5091, 16p
Publication Year :
2020

Abstract

The importance of effective surgical wound care cannot never be underestimated. Poorly managing surgical wounds may cause many serious complications. Thus, it raises the necessity to develop a patient-friendly self-care system which can help both patients and medical professionals to ensure the state of the surgical wounds without any special medical equipment. In this paper, a surgical wound assessment system for self-care is proposed. The proposed system is designed to enable patients capture surgical wound images of themselves by using a mobile device and upload these images for analysis. Combining image-processing and machine-learning techniques, the proposed method is composed of four phases. First, images are segmented into superpixels where each superpixel contains the pixels in the similar color distribution. Second, these superpixels corresponding to the skin are identified and the area of connected skin superpixels is derived. Third, surgical wounds will be extracted from this area based on the observation of the texture difference between skin and wounds. Lastly, state and symptoms of surgical wound will be assessed. Extensive experimental results are conducted. With the proposed method, more than 90% state assessment results are correct and more than 91% symptom assessment results consistent with the actual diagnosis. Moreover, case studies are provided to show the advantage and limitation of this system. These results show that this system could perform well in the practical self-care scenario. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
21682216
Volume :
50
Issue :
12
Database :
Complementary Index
Journal :
IEEE Transactions on Systems, Man & Cybernetics. Systems
Publication Type :
Academic Journal
Accession number :
147133574
Full Text :
https://doi.org/10.1109/TSMC.2018.2856405