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UTBB MOSFETs Thermal Coupling Analysis in Technological Node Level.
- Source :
- Journal of Integrated Circuits & Systems; 2020, Vol. 15 Issue 2, p1-5, 5p
- Publication Year :
- 2020
Details
- Language :
- English
- ISSN :
- 18071953
- Volume :
- 15
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- Journal of Integrated Circuits & Systems
- Publication Type :
- Academic Journal
- Accession number :
- 145396989
- Full Text :
- https://doi.org/10.29292/jics.v15i2.194