Transceiver Front-End Architectures Using Vibrating Micromechanical Signal Processors.

This chapter focuses on communications subsystem performance enhancements potentially attainable via use of vibrating micromechanical resonator circuits in MEMS-based transceiver architectures. Section 12.2 begins by reviewing the issues involved with transceiver miniaturization, specifically focusing on the need for high Q. Section 12.3 follows with an overview of various micromechanical signal processing circuits, describing micromechanical tanks, filters, mixer-filters, and switches and providing sufficient detail to facilitate the incorporation of such circuits into communications subsystems. Specific transceiver architectures using such devices are then presented in Sections 12.4 and 12.5, with a focus on the specific performance enhancements afforded by each approach. Section 12.6 then serves as a reminder that this is still a fledgling technology, emphasizing the present limitations of this technology and giving a sprinkling of the specific research problems that must be solved before the architectures of Sections 12.4 and 12.5 can become a reality. Sections 12.7 and 12.7.4.1 finally close the chapter with details on techniques for combining mechanical and transistor circuits onto single chips. [ABSTRACT FROM PUBLISHER]