Silicon Photonic 2.5D Multi-Chip Module Transceiver for High-Performance Data Centers.

MLA

Abrams, Nathan C., et al. “Silicon Photonic 2.5D Multi-Chip Module Transceiver for High-Performance Data Centers.” Journal of Lightwave Technology, vol. 38, no. 13, July 2020, pp. 3346–57. EBSCOhost, https://doi.org/10.1109/JLT.2020.2967235.

APA

Abrams, N. C., Cheng, Q., Glick, M., Jezzini, M., Morrissey, P., O’Brien, P., & Bergman, K. (2020). Silicon Photonic 2.5D Multi-Chip Module Transceiver for High-Performance Data Centers. Journal of Lightwave Technology, 38(13), 3346–3357. https://doi.org/10.1109/JLT.2020.2967235

Chicago

Abrams, Nathan C., Qixiang Cheng, Madeleine Glick, Moises Jezzini, Padraic Morrissey, Peter O’Brien, and Keren Bergman. 2020. “Silicon Photonic 2.5D Multi-Chip Module Transceiver for High-Performance Data Centers.” Journal of Lightwave Technology 38 (13): 3346–57. doi:10.1109/JLT.2020.2967235.