Heat transfer enhancement of a microchannel heat sink with the combination of impinging jets, dimples, and side outlets.

With the rapid increasing heat fluxes released from micro electronic devices, thermal management of electric components faces huge challenge. High working temperature generated by the chip will directly affect its performance. It is essential to develop advanced model to enhance heat transfer. In this study, a new microchannel heat sinks with impinging jets and dimples (MHSIJD) model with side outlets was proposed. Computational fluid dynamics simulation methodology with RNG k–ε turbulence model was used to investigate the performance of MHSIJD with side outlets. Valuation indices including thermal capability, pump consumption and overall performance were analyzed. Three models were compared with basic model (MHSIJD without side outlets): the cross section of the side outlet was set as 0.2 × 0.2 mm (Case 1), 0.4 × 0.4 mm (Case 2), and 0.6 × 0.6 mm (Case 3). The results showed that: (1) the MHSIJD with side outlets performs better heat transfer characteristic due to the alleviation of drift phenomenon. The heat transfer capacity can be increased by up to 17.51%; (2) the MHSIJD with side outlets exhibits a lower pressure drop, which can be reduced up to 22.39%; and (3) the overall performance of MHSIJD with side outlets is better due to its higher cooling efficiency and lower pump consumption. [ABSTRACT FROM AUTHOR]