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回流焊峰值温度对混装BGA 焊点的影响研究.

Authors :
张艳鹏
王 威
王玉龙
张雪莉
Source :
Electronic Components & Materials; May2020, Vol. 39 Issue 5, p86-89, 4p
Publication Year :
2020

Abstract

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Details

Language :
Chinese
ISSN :
10012028
Volume :
39
Issue :
5
Database :
Complementary Index
Journal :
Electronic Components & Materials
Publication Type :
Academic Journal
Accession number :
143503061
Full Text :
https://doi.org/10.14106/j.cnki.1001-2028.2020.05.013