Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability.

Authors :: Kelly, Marion Branch
Maity, Tapabrata
Nazmus Sakib, A. R.
Frear, D. R.
Chawla, Nikhilesh
Source :: Journal of Electronic Materials; Jul2020, Vol. 49 Issue 7, p4466-4467, 2p
Publication Year :: 2020
Abstract: In the original article, there is an error in Fig. 1. Following is the corrected Fig. 1. [ABSTRACT FROM AUTHOR]

Subjects :: LEAD-free solder
SOLDER joints
SURFACE finishing
SOLDER & soldering
METALLURGY
FLIP chip technology
MICROSTRUCTURE

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