A Novel Self-Feedback Intelligent Vision Measure for Fast and Accurate Alignment in Flip-Chip Packaging.

A template matching (TM) algorithm has been widely employed in a visual inspection process of wafer-level flip-chip packaging, but the structures of traditional TM algorithms are always direct feedforward, which leads to the difficulty in achieving fast speed and high accuracy at the same time. The motivation of this article is to combine the ability to enable the chip visual measurement running in a fast-speed and high-accuracy manner. First, a novel self-feedback intelligent template matching (SFI-TM) structure is proposed, which can enable the intermediate information in the matching process to be fully utilized. The intelligent speed and resolution regulation rules are combined to construct the SFI-TM algorithm. Then, the reliability and robustness of the SFI-TM algorithm are theoretically analyzed to make sure it works in a stable manner. Finally, a series of practical chip alignment visual inspection experiments, including parameter testing, comparing experiments with the other five proposed visual detection algorithms, and robustness testing, are carried out in detail, respectively. The experimental results indicate that the SFI-TM algorithm can achieve the highest average measurement accuracy (1.08  $\mu$ m) with almost the same measurement speed as fast as Tiny YOLOv2, and that it can resist the brightness variation from $-$ 20 to 30 gray value, the pepper–salt noise with a density of 0.5/pixel, and the Gaussian noise with a large variance of 2.5. In addition, it has good robustness against blurring and distortion of images under the dynamic speed motion processes. [ABSTRACT FROM AUTHOR]