Study on wettability of low-melting alloy material on copper substrates.

In this paper, four low-melting alloy materials, Sn-3.5Ag, Sn-1.6Cu, Sn-Zn-0.7Cu and Sn-8Zn-3Bi, were used to study the wettability of these materials on copper substrates. Using the Image Pro Plus software to calculate the spread area and analyze the spread-ability of low-melting alloy materials with different compositions on the copper substrate. The calculation results show that the low-melting alloy material with strong spreading property is Sn-1.6Cu. The interface morphology of Sn-1.6Cu on the copper substrate after wetting equilibrium was observed by SEM and EDX instruments. The interface quality was judged according to the interface morphology, and the interface element distribution and element penetration were analyzed. The experimental results show that the interface between Sn-1.6Cu and the copper substrate is reliable, and there are no interface defects such as porosity, slag inclusion and crack. The research work in this paper provides a theoretical basis for the subsequent material improvement research. [ABSTRACT FROM AUTHOR]